Solid-State Relays vs. Mechanical Relays: Which is the Better?

In the vast arena of electrical control, relays are undoubtedly a very critical role. They are like loyal guards in the circuit world, silently guarding the stability and safety of the circuit.

Liquid-cooled UQD quick connectors usher in opportunities

NVIDIA GB200 NVL4 high-power chip debuts, accelerating the innovation of supercomputing heat dissipation. As a key component of liquid cooling, UQD quick connectors debuted in the midst of change and ushered in the dawn of opportunity.

AWRL6844: How a chip helps in-vehicle safety sensing

This article discusses the design challenges facing OEMs and how the AWRL6844, a 60 GHz radar sensor with edge AI, can help automotive designers address these issues.

USB Type-C standard data and power configuration method

USB Type-C interface has a unique reversible design with 24 pins inside that define a variety of signal and power lines. When device A and device B are connected via a USB Type-C cable, the first step is a physical connection, with the pins docking with each other, which builds a basic channel for subsequent data and power transmission.

What is a Farad capacitor? Advantages and disadvantages of Farad capacitors

Farad capacitors, also known as supercapacitors and gold capacitors, are capacitors with special properties. Their capacitance can reach the Farad level or even higher, which is much higher than the capacity of ordinary capacitors.

What is RFID technology?

(RFID) Radio Frequency Identification is a contactless automatic identification technology that automatically identifies the target object and obtains relevant data through radio frequency signals.

Door Control System Design for Automotive Electronics

This article introduces the development of connected door electronics and explains the advantages and disadvantages of centralized and decentralized approaches. It then explores how ASSP can be used to simplify the design of a single body control unit (BCU) in a centralized design, or individual BCUs for each door in a decentralized design.

ST MEMS adapter board based on STM32F401VE and compatible with all ST MEMS adapters

STEVAL-MKI109V3 is a professional MEMS tool provided by STMicroelectronics. It is a ready-to-use MEMS board development platform

Advanced Packaging and Chiplet: A New Era in Semiconductor Design

Today, semiconductor giants can use advanced packaging technology to produce CPU or GPU multi-die components with excellent density, energy efficiency and performance. However, the real potential of chiplets is to democratize the design of complex silicon systems.

What is an RF conductive switch

Discrete switches are also called RF conductive switches. Their function is to connect any one or several of the multiple RF signals through control logic to achieve switching of different signal paths, including switching between reception and transmission, switching between different frequency bands, etc.

【NEW】ALINX Releases AXVU13P: AMD Virtex UltraScale+ FPGA PCle 3.0 Development Platform

ALINX releases AMD Virtex UltraScale+ series FPGA PCIe 3.0 comprehensive development platform AXVU13P

Why is there a lot of photoresist residue on the microfluidic silicon wafer after development?

Why is there a lot of photoresist residue on the microfluidic silicon wafer after development?