ALINX releases AMD Virtex UltraScale+ series FPGA PCIe 3.0 comprehensive development platform AXVU13P

This high-performance development and verification platform equipped with AMD 16nm process XCVU13P chip is designed to cope with complex application scenarios and high bandwidth requirements with its excellent computing power and flexible scalability, helping technology developers accelerate product innovation and deployment.

With the rapid development of 5G, artificial intelligence and high-performance computing, the demand for computing power, flexibility and high-speed data transmission in various industries continues to rise. FPGA has become a key technology to solve industry pain points with its high programmability and real-time parallel processing capabilities. ALINX's AMD Virtex UltraScale+ FPGA PCIe 3.0 comprehensive development platform has reached new heights in performance and functionality, and fully empowers industry innovation with powerful computing power, high-speed communication capabilities and flexible scalability.

5G Base Station and Network Acceleration

The platform has 76 GTY high-speed transceivers, supporting rates up to 28.21 Gb/s, easily meeting the high bandwidth and low latency requirements in 5G base stations and network communications. The 3-way FMC+ interface makes external module expansion more convenient, meeting the complex needs of the development of cutting-edge communication technologies.

Artificial Intelligence and Machine Learning

The XCVU13P chip has 3.78 million logic units and 38.3 TOPS of INT8 DSP peak performance, providing strong power for deep learning reasoning and training tasks. It is an ideal choice for AI acceleration in data centers, and is also suitable for the balance of computing power and power consumption in edge computing.

Industrial Control and Test and Measurement

With 12,288 DSP slices, this platform can handle complex signal processing tasks, support precision measurement and real-time control scenarios, and help the comprehensive upgrade of Industry 4.0 smart manufacturing.

In terms of interfaces, the PCIe 3.0 x16 interface used by AXVU13P provides a communication rate of 8 Gbps per channel, which can escort customers' multi-tasking needs. It uses 1 DDR4 SODIMM memory slot with a capacity of up to 16GB, allowing users to select and install memory according to their needs to cope with high-speed data processing of different scales.

The 3-way FMC+ interface supports up to 56 channels of GTY high-speed transceivers, which can connect various standard FMC and FMC+ modules, bringing users more flexibility and scalability. Multiple expansion interfaces such as 2-way 128MB QSPI Flash, 2-way SMA input and output interfaces, and 1-way UART to USB interface make development more flexible, from prototype design to mass production in one step.

The application scenarios of this platform cover multiple cutting-edge fields. In the fields of 5G base stations and network acceleration, radar systems, test and measurement, as well as machine learning, AI reasoning, simulation and prototyping, AXVU13P can provide a reliable foundation for industry technological breakthroughs with its excellent performance and flexibility.